Polymaker PC-ABS
Polymaker · PC/ABS filament for FFF
Overview
Polycarbonate and ABS blend that combines toughness with high heat resistance and gives a smooth surface well suited to metal plating. It requires an enclosure that holds high ambient heat.
Summarised from the Polymaker product page.
- Material type
- Engineering
- Brand family
- Polymaker
- Polymer
- PC/ABS
- Processing technology
- FFF
- Material form
- Filament
- Manufacturer
- Polymaker
- Reinforcements
- None
Characteristics
- High tempHeat deflection temperature of 100 °C or more — keeps its shape in hot environments.
Certifications
- RoHSFree of restricted hazardous substances such as lead, mercury and cadmium (EU RoHS directive) — needed for electrical and electronic products sold in the EU.
- REACHComplies with the EU REACH regulation on chemicals — no substances of very high concern above the allowed limits.
As stated by Polymaker — RoHS and REACH are Polymaker declarations covering its whole product range. Ask us for the certificate if you need it for an audit.
Applications
Based on this material's datasheet values. Every part is different — ask an engineer to confirm it suits yours.
Physical
- 1.1g/cm³ ISO1183, GB/T1033
- 11-17g/10 min 260°C, 5 kg
Thermal
- 109°C DSC, 10°C/min
- N/A /°C TGA, 20°C
- 135°C ISO 306,GB/T 1633
- 106°C ISO 75, 1.8MPa
Mechanical
- 1835 ± 65MPa ISO 527, GB/T 1040
- 39.9 ± 1.0MPa ISO 527, GB/T 1040
- 4.2 ± 0.3% ISO 527, GB/T 1040
- 2081 ± 106MPa ISO 178, GB/T 9341
- 66.3 ± 0.9MPa ISO 178, GB/T 9341
- 25.8 1.3kJ/m² ISO 179, GB/T 1043
- 13 2kJ/m² ISO 179-1, 1eA:2010,-30°C
Chemical resistance
Versus other PC/ABS
See where it ranks against the 3 other PC/ABS materials we stock.
Typical values from each manufacturer's datasheet. Test methods can differ between brands, so treat small gaps as a tie.
Downloads
- Manufacturer datasheetSent on requestRequest
- Quick3D summaryThis page as a printable PDF
Values from the Polymaker technical data sheet and product page. Last updated . Typical values, not guaranteed minimums — see the disclaimer below.