Quick3D 3DXTECH 3DXSTAT ESD-PC
3DXSTAT · PC filament for FFF
Overview
Static-dissipative polycarbonate filament loaded with carbon nanotubes, targeting 10^4 to 10^9 ohm surface resistance. Combines a 147C Tg and impact resistance with ESD protection for sensitive applications.
Summarised from the 3DXTECH product page.
Features
- Material type
- Engineering
- Brand family
- 3DXSTAT
- Polymer
- PC
- Processing technology
- FFF
- Material form
- Filament
- Manufacturer
- 3DXTECH
- Reinforcements
- None
Characteristics
- High tempHeat deflection temperature of 100 °C or more — keeps its shape in hot environments.
- ESD-safeStatic-dissipative (surface resistivity 10⁹ Ω/sq or lower) — safe around sensitive electronics.
Applications
Based on this material's datasheet values. Every part is different — ask an engineer to confirm it suits yours.
Physical
- 1.24g/cm³ ISO 1183
- 10⁷ - 10⁹Ω/sq ASTM D257
Thermal
- 143°C DSC
- 135°C ISO 75, 0.45 MPa
Mechanical
- 2300MPa ISO 527
- 68MPa ISO 527
- 6% ISO 527
- 2310MPa ISO 178
- 95MPa ISO 178
Versus other PC
See where it ranks against the 8 other PC materials we stock.
Typical values from each manufacturer's datasheet. Test methods can differ between brands, so treat small gaps as a tie.
Downloads
- Manufacturer datasheetSent on requestRequest
- Quick3D summaryThis page as a printable PDF
Values from the 3DXTECH technical data sheet and product page. Last updated . Typical values, not guaranteed minimums — see the disclaimer below.