Quick3D 3DXTECH ezPC Polycarbonate
ezPC · PC filament for FFF
Overview
A polycarbonate filament developed for easy printing with strong mechanical and thermal performance. It suits working prototypes and final parts that PLA, PETG or ABS cannot handle, sitting between those and PEI or PEEK.
Summarised from the 3DXTECH product page.
- Material type
- Engineering
- Brand family
- ezPC
- Polymer
- PC
- Processing technology
- FFF
- Material form
- Filament
- Manufacturer
- 3DXTECH
- Reinforcements
- None
Characteristics
- High tempHeat deflection temperature of 100 °C or more — keeps its shape in hot environments.
Applications
Based on this material's datasheet values. Every part is different — ask an engineer to confirm it suits yours.
Physical
- 1.2g/cm³ ISO 1183
- >10¹³Ω/sq ASTM D257
Thermal
- 118°C DSC
- 112°C ISO 75, 0.45 MPa
Mechanical
- 2180MPa ISO 527
- 58MPa ISO 527
- 14% ISO 527
- 2150MPa ISO 178
- 91MPa ISO 178
Versus other PC
See where it ranks against the 8 other PC materials we stock.
Typical values from each manufacturer's datasheet. Test methods can differ between brands, so treat small gaps as a tie.
Downloads
- Manufacturer datasheetSent on requestRequest
- Quick3D summaryThis page as a printable PDF
Values from the 3DXTECH technical data sheet and product page. Last updated . Typical values, not guaranteed minimums — see the disclaimer below.